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Equipment database NanoLabNL

Are you looking for a specific tool for lithography, thermal processing or deposition? Or do you already have a specific tool in mind and looking for a Nano Lab NL-location where you can find that tool?

Please use our equipment database to find what you are looking for. Search by:

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id Tool name Location Process Sub-process Function Specimen
1 CMP wafer cleaning bench MESA+ NanoLab Twente Miscellaneous CMP Cleaning CMP substrates Single wafer 100 mm
2 CO2 snow TNO NanoLab Delft Miscellaneous Special cleaning Cleaning (blow) technique
3 Cobra AMOLF NanoLab Amsterdam Etching RIE systems Patterning of samples with Photo Resist mask. up to wafer 100 mm
4 CoMAT IMS MESA+ NanoLab Twente Film formation Laser ablation
5 Contact angle measurement Dataphysics OCA-2 MESA+ NanoLab Twente Characterisation Contact angle Surface inspection maximum substrate diameter approx. 100 mm; clean wafers only; virtually every substrate material
6 Convac_Spinner_MEMS EKL Nanolab Delft lithography Spin coating
7 Critical point dryer Philips Innovation Services Wet processing Cleaning Max. 8 inch diameter
8 Critical point drying Kavli Nanolab Delft Wet processing CPD Critical point drying 20 mm wafers
9 Cryogenic probe station Zernike Nanolab Groningen Inspection Non-destructive electrical testing Upto wafer size 4 inch
10 Cu plating Philips Innovation Services Wet processing Inorganic processes Max. 8 inch diameter
11 Cu-plaiting bath own design MESA+ NanoLab Twente Miscellaneous Cu-plating Plating proces Small samples up to 100 mm
12 Curve tracer prober tektronix MESA+ NanoLab Twente Characterisation Stress curvature Electrical measurement Up to 100 mm
13 CV measurement system Philips Innovation Services Characterisation Electrical characterisation Max. 8 inch diameter
14 Dama 500 dual head Philips Innovation Services Miscellaneous CMP Max. 8 inch diameter
15 Dama SPF650-2 Philips Innovation Services Miscellaneous CMP Max. 8 inch diameter
16 Dataphysics_Contact_Angle_System_OCA20 EKL Nanolab Delft characterisation Contact angle
17 Deep reactive ion etcher (ICP-Bosch) Kavli Nanolab Delft Etching DRIE systems Dry etching of Silicon, Silicon oxide, and some metals like W, Mo. Resist etching Max. 4 inch (100 mm) wafer, small pieces allowed.
18 Deep reactive ion etcher (ICP-Cryo) Kavli Nanolab Delft Etching DRIE systems Dry (an)isotropic etching of Silicon and W. Max. 4 inch (100 mm) wafer, small pieces allowed.
19 Dektak_150_MEMS EKL Nanolab Delft Inspection / Metrology Stylus
20 Dektak_8 EKL Nanolab Delft Inspection / Metrology Stylus

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